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3880 Decoto Road #139, Fremont, CA 94555, USA


Cell: (510) 676 5629
Bath & Associates Consultancy LLC

Professional Background:

Over fifteen years experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies.

I work well individually and in a team and have coordinated and completed projects successfully in the areas of my responsibility. I have extensive knowledge of lead-free and tin-lead soldering technologies and have been consulted in these and other areas by various electronic companies. I have excellent verbal and written communication skills and enjoy presenting to groups. I have regularly attended and presented at technical meetings and conferences globally, as well as chairing multiple industry groups and initiatives.

Professional Experience:

Bath and Associates Consultancy LLC, Fremont, CA, USA
Owner 9/08 to present
Process consulting and training services in the electronics manufacturing industry.

Principal Engineer for IPC. Provide support for IPC standards and IPC Technology Roadmap.

Consulting Engineer for CGI Americas and Koki Solder. Provide technical support for soldering and solar materials with input into development of tin-lead and lead-free soldering materials including halide-free and anti head-in-pillow pastes.

INEMI Consultant: Chair of INEMI lead-free rework optimization project on 125mil (3.3mm) thick network test board for 1st pass, rework and ATC reliability assessment.

Consultant for Foxconn (Hon Hai) on lead-free process development project with Brocade on wave and wave rework.

Keynote speaker for the Vitronics-Soltec lead-free seminar series on Best Practices and Industry Trends in Electronics Assembly.

Consultant for lead-free assembly/reliability project for the Department of Defense

Flextronics International/ Solectron, San Jose, CA, USA
Lead Engineer, Technology Leadership Group 11/98 to 7/08

Research, development and qualification of tin-lead and lead-free soldering materials, processes and components. Global lead engineer for lead-free.

International Tin Research Institute (ITRI)/ SolderTec, England.
Technical Officer, Soldering Technology 5/93-9/98

Research and development of the company's products and services. Solder panel members included HP, Motorola, Cookson, Amkor, Intersil, Panasonic, Kester.


MS Materials Science: [1992]
University of Manchester/UMIST, Manchester, England, U.K.
BS Materials Science: [1991]
University of Manchester/UMIST, Manchester, England, U.K.

Certificate for outstanding lead-free project leadership [iNEMI]: 2001, 2002, 2005.

IPC APEX Conference 2007 and 2011 Best US & International Paper Award Author

SMTA[Surface Mount Technology Association] Silicon Valley Secretary, Past Chapter President and Vice-President Technical Programs and Membership Chair.

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